Circuit Fabology Microelectronic Equipment Co., Ltd. (CFMEE), was founded in June 2015 with a registered capital of RMB 120.8 million. It locates in the Integrated Circuit Industrial Park of National High-tech Industry Development Zone, Hefei. The company, with its core competence in micro-nano direct imaging technologies, engages in design, development, manufacture, and marketing industry-leading direct imaging (DI) lithography systems, serving IC, photo mask, high-end PCB, IC packaging, and flat panel display markets among others.
CFMEE is a R&D driven company, owns a strong intellectual property portfolio of 79+ patents. Backed by its superior innovative solutions, the company has established "Foreign Expert Studio" and "Postdoctoral Research Station" upon government approval.
Since establishment in 2015, we have successively won a series of honor including "Little Giant of Science & Technology Cultivation Enterprises", "Hefei Direct Writing Lithography Equipment Engineering Research Center", "National High-Tech Enterprises" , "2018 Top 100 Enterprises in China's PCB Industry" and many other awards, including National Second Prize in 2019 "Maker in China" SME Innovation Entrepreneurship Competition and National Second Prize in the Innovation Entrepreneurship Competition for Advanced Manufacturing Industries in China.
CFMEE focuses on serving customers in the PCB and pan-semiconductor industries. With its superior products, it helps its customers achieving digitization, automation and intelligent manufacturing through product quality enhancement and cost saving. After many years of innovative research and development, our products have served morethan100 customers, including Shennan Circuits Co., Ltd. , Tripod Technology and other industry leading enterprises.To strengthen customer relations, CFMEE signed strategic cooperation agreements with its core customers, including some public listed companies.
We aim to "meet and exceed customer expectations". The company continuously improves its sales and after-sales service system. Currently, the company has set up three service offices located in Shenzhen, Suzhou, and Taiwan, respectively, to provide customers with 24/7 onsite technical support.
In 2020, the company built a 35,000㎡ facility that integrates R&D, manufacturing, and administration office together. It marks a new milestone in the path of CFMEE's growth. We will continue to pursue innovative strategies in technology development, corporate operation, talent acquisition and management, and create social and commercial values through technical innovation.
|Earnings Per Share||0.78||0.6||Not applicable|
|R&D expenditure as a % of operating revenue||10.95%||14.12%||19.45%|
|Total Owners' Equity||408.59||337.33||112.65|
|Net Cash Flows-Operating||-59.71||-15.88||1.82|
|Net Cash Flows-Investing||55.76||-91.69||-21.05|
|Net Cash Flows-Financing||13.61||164.59||27.96|
|Name||No. of Shares Held (mn)||% of Shares Held|
|Hefei Yage Semiconductor Technology Partnership(L.P.)||12.6||10.43|
|Jingning Dingqing Electronic Technology Partnership(L.P.)||7.98||6.61|
|Suzhou Zhonghe Chunsheng No. 3 Investment Center(L.P.)||4.99||4.13|
|Hefei Kangtong Equity Investment Partnership(L.P.)||4.61||3.82|
|Shanghai Juyuan Juxin Integrated Circuit Industry Equity Investment Fund Centre(L.P.)||3.64||3.01|
|Hefei Innovation Sci-tec Venture Capital Co., Ltd.||2.60||2.15|
|SDIC(Ningbo)Science and Technology Achievements Transformation Venture Capital Investment Partnership(L.P.)||2.36||1.95|
|Shenzhen Qifu Guolong Small and Medium Micro-Enterprise Equity Investment Fund Partnership(L.P.)||2.22||1.84|
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