We continue to consolidate the existing technology and work hard to improve the performance of our products. Through improving processes and designing unique methods to improve the products, we have improved the common problems in the industry, such as pores, dielectric loss, particle agglomeration, hole wall cracks, partial discharge control under ultra-high voltage, and so on.

We continue to increase investment in the research and development of silicon-based nitrides, aluminum-based nitrides, silicon-based hollow spheres, and chemically prepared micro-nano spherical silica. We set up subsidiaries to build factories for the special industrialized manufacturing of liquid fillers and a special layout for the production of spherical alumina fillers.

Under the guidance of the vision of "strive to be a partner that customers always trust", we closely focus on industry development trends and strategically cooperate with leading domestic and foreign industry customers. After years of continuous R&D investment and technology accumulation, we already have the industry-leading technical level. Our products are widely used in semiconductor and new energy vehicle-related businesses such as epoxy plastic packaging materials and underfill materials for chip packaging, CCL for printed circuit board, thermal interface materials, electronic packaging materials, etc; Building adhesives, artificial quartz board, and honeycomb ceramic carrier for environmental protection and energy conservation; And UHV electrical insulation products, 3D printing materials, dental materials, and other emerging business.