Established in 2004, Montage Technology is headquartered in Shanghai and has branches in Kunshan, Macao, Silicon Valley of USA and Seoul of South Korea. Montage Technology was listed on the Star Market of Shanghai Stock Exchange on July 22, 2019.
As one of the leading fabless semiconductor companies, Montage Technology is committed to providing high-performance IC based solutions for cloud computing and artificial intelligent (AI) markets. Based on years of expertise in research and development, Montage Technology has delivered various products including memory interface chip, Jintide® CPU and hybrid security memory module (HSDIMM®). Highly recognized in the industry for the excellent performance, the products of Montage Technology have been widely used in the servers in data center, cloud computing and artificial intelligence markets to meet the needs of new-generation servers for high performance, high reliability and high security. Montage Technology pays attention to intellectual property protection. As of June 30, 2019, Montage Technology has obtained 94 domestic and foreign patents.
Dedicated for more than 10 years in the memory interface technology, Montage Technology is able to deliver high-speed, large-capacity memory buffer solutions of DDR2 to DDR4 to meet the growing demand in data centers. Montage Technology's invention of DDR4 fully buffered “1+9” distributed architecture is adopted by JEDEC as an international standard, and its related products have successfully entered the industry mainstream memory, server and cloud computing fields and served the majority of the global market.
Since 2016, Montage has been cooperating with Tsinghua University and Intel to develop Jintide® CPU. A high-performance Jintide® server platform combining Jintide® CPU with Montage's hybrid security memory module (HSDIMM®) has been launched. The platform has realized real-time security monitoring function at silicon level and can play an important role in the information security field. This architecture also incorporates advanced heterogeneous processing and interconnect technologies for future AI and big data applications, which provides strong support of comprehensive data processing and computing power for various applications in the AI era.
Montage Technology has received numerous industry awards and recognition, including: in 2016, received appraisal from Chinese Institute of Electronics -- "The overall technology of Montage Technology's low-power DDR series memory buffers ranks the international leading level"; and received First Prize of Science and Technology Award from Chinese Institute of Electronics for its memory buffer technology and industrialization project; in 2018, the Dynamic Security Check (DSC) technology adopted by Jintide® CPU and Jintide® server platform was awarded one of the World Internet Leading Scientific and Technological Achievements in the 5th World Internet Conference; in 2019, won First Prize of Shanghai Technology Invention for its High-performance DDR memory buffer controller chip design technology.
|Earnings Per Share||0.87||0.46||0.12|
|R&D expenditure as a % of operating revenue||15.74%||15.34%||23.46%|
|Total Owners' Equity||3,615.75||1,187.01||883.02|
|Net Cash Flows-Operating||969.15||226.83||387.08|
|Net Cash Flows-Investing||-99.92||37.72||-222.67|
|Net Cash Flows-Financing||1,692.24||-||-29.53|
|Name||No. of Shares Held (mn)||% of Shares Held|
|Intel Capital Corporation||101.68||10.00%|
|WLT Partners, L.P.||87.82||8.64%|
|Xinyun Capital Fund I, L.P.||44.25||4.35%|
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